Iindlela eziMithathu zoKuhluleka koMbane

Yonke into ehlulekayo ngexesha elithile kunye nekhompyutheni ayikho into. Ukukwazi ezi ndlela ezintathu zokungaphumeleli ezinkulu kunokunceda abanqulunqa ukudala izinto ezinzulu kunye nokucwangcisa ukuhluleka okulindelekileyo.

Iindlela zokusilela

Kukho izizathu ezininzi zokuba kutheni izixhobo zingaphumeleli . Ezinye iintsilelo zityhutyha kwaye zinobubele xa kukho ixesha lokuchonga iqela kwaye litshintshe ngaphambi kokuba liphumelele ngokupheleleyo kwaye izixhobo ziyahla. Ezinye iintsilelo zikhawuleza, zinobudlova kwaye zingalindelekanga, zonke ezo zivivinywa ngexesha lokuvavanya kweemveliso zeemveliso.

IPhakethe yePakethe yehluleka

Iphakheji yecandelo linikeza imisebenzi emibini engundoqo, ukukhusela icandelo kummandla kunye nokubonelela indlela yokuba iqela lidibaniswe kwisekethe. Ukuba isithintelo sikhusela icandelo ekuphumeni kwendalo, ngaphandle kwezinto ezinjengomngcipheko kunye ne-oksijini kunokukhawuleza ukuguga kwecandelo kwaye kubangela ukuba iphumelele ngokukhawuleza. Ukungaphumeleli kwamatshini kwiphakheji kunokubangelwa zimbalwa zezinto ezibandakanya uxinzelelo lwe-thermal, i-chemical cleansers, kunye nokukhanya kwe-ultraviolet. Zonke ezi zizathu zinokuthintelwa ngokulindela ezi zinto ziqhelekileyo kwaye zilungelelanise ukuyila ngokutsho. Ukungaphumeleli kwamatshini kungenye yezizathu zokuhluleka kwephakheji. Ngaphakathi kwiphakheji, iimpembelelo ekuveliseni zingakhokelela ekufutshane, ukufumaneka kweekhemikhali ezibangele ukuguga ngokukhawuleza kwe-semiconductor okanye iphakheji, okanye ukutyhulwa kwiimpawu zokusasaza ezixhaphaza njengokuba inxalenye isetyenziselwa imijikelezo ye-thermal.

I-Solder Joint and Failures

Amanxeba adibeneyo anikezela ngeendlela eziphambili zokuqhagamshelana phakathi kwecandelo kunye nesiphaluka kunye nesabelo sabo esifanelekileyo sokungaphumeleli. Ukusebenzisa uhlobo olungafanelekanga lwe-solder kunye neCandelo le-PCB kunokukhokelela ekusebenziseni i-electromigration yezinto kwi-solder eyenza iindawo ezinobumba ezibizwa ngokuba yi-intermetallic layers. Ezi zihloko zikhokelela ekudibaneni amaqhekeza kunye nexesha eliqhelekileyo ekufumaneni okokuqala. Imijikelezo ye-thermal nayo yimbangela ebalulekileyo yokuhluleka okuhlanganyeleneyo, ngokukodwa xa ixabiso lokunyusa kwamafutha (izinto ezincinci, i-solder, i-PCB trace, kunye ne-PCB trace) zihlukile. Njengoko zonke ezi zinto zitshisa kwaye zipholile, uxinzelelo olukhulu lwangaphakathi luyakwenza phakathi kwabo abangakwazi ukuphula uxhumano lwe-solder ngokomzimba, ukulimaza icandelo, okanye ukuhlenga i-PCB trace. I-whiskers ye-tin ekukhokela abathengisi bamahhala banokuba yingxaki. I-whiskers ye-Tin ikhula ngaphandle kwekhokelo yama-solder joints angayibhanqa oonxibelelwano okanye aphule kwaye enze iifutshane.

I-PCB yehluleka

Iibhodi ze-PCB zinemithombo emininzi yokungahluleki, ezinye zivela kwinkqubo yokuvelisa kunye nezinye ezivela kwindawo yokusebenza. Ngethuba lokuvelisa iifom ebhodini lePCB lingahle lenziwe ngokugqithiseleyo likhokele kwizijikelezo ezimfutshane, iisekethe ezivulekile, kunye nemigca yesiganeko. Kwakhona iiphemikhali ezisetyenzisiweyo kwi-PCB yokubethela ibhodi zingasuswa ngokupheleleyo kwaye zenze amancinci njengoko iimpawu zidliwe kude. Ukusebenzisa ubunzima obunobunxi bezinto zobuncwane okanye izinto ezinokubangela izinto zingabangela ukunyuka kwengqondo ezongezelelekileyo eziza kufutshane nobomi be-PCB. Ngeendlela zonke zokungaphumeleli ekuveliseni i-PCB, ukungaphumeleli kuninzi kwenzeka ngexesha lokuveliswa kwe-PCB.

I-ecddering kunye nokusebenza kwendawo ye-PCB ihlala ikhokelela kwiintlobo ezahlukeneyo zePCB kwixesha. I- solder flux esetyenziselwa ukuhlanganisa zonke izixhobo kwi-PCB inokuhlala phantsi komgangatho we-PCB oya kuyidla kwaye idibanise nayiphi na isinyithi edibana nayo. I-Solder flux ayilona nto kuphela ephazamisayo ehlala ifumana i-PCB njengokuba ezinye izixhobo zingaphaya kwamanzi amaninzi anokuhlambalaza ngexesha kwaye amanxeba amanxeba ahlambulukileyo anokuba nefuthe elifanayo okanye ashiye i-residu eqhubayo eyenza iifutshane ebhodini. I-cycling ye-Thermal yinto ebangela ukuhluleka kwe-PCB engakhokelela ekugqithiseni i-PCB kwaye idlala indima ekuvumela ukuba iintsimbi zensimbi zikhule phakathi kweendawo ze-PCB.