Izitishi zokufudumala emoyeni ezifudumeleyo zixhobo ezixakekayo xa ukwakha ii-PCB. Ngokuqhelekileyo isicwangciso sebhodi siza kuba sigqibeleleyo kwaye ngokuqhelekileyo iifom kunye nezixhobo kufuneka zisuswe kwaye zitshintshwe ngexesha lwenkqubo yokujongana neengxaki. Ukuzama ukususa i-IC ngaphandle komonakalo kungekudala ngaphandle kwesikhululo somoya eshushu. Ezi ngcebiso kunye neengcinga zokutshisa umoya oshisayo ziya kufaka indawo yezinto kunye nama-IC alula kakhulu.
Izixhobo Ezifanelekileyo
Ukuphinda uhlaziye isisombululo kufuna izixhobo ezimbalwa ngaphezulu nangaphezulu kwe-setup soldering setup. Ukuhlaziywa okusemgangathweni kunokwenziwa kunye nezixhobo ezimbalwa kuphela, kodwa iipsiti ezinkulu, kunye nezinga eliphezulu lokuphumelela (ngaphandle kokulimaza ibhodi) izixhobo ezimbalwa ezongezelelweyo zicetyiswa kakhulu. Izixhobo eziphambili zi :
- Isikhululo se-rework air air hot (ulungelelaniso oluchanekileyo kunye nokulawula ukuhamba kwamanzi kubalulekile)
- I-wicker wick
- Ukudibanisa i-Solder (ukulungiswa)
- I-Solder flux
- Isinyithi esinyanisiweyo (kunye nokulawula ukushisa okuguquguqukayo)
- Tweezers
Ukwenza i-solder kabusha ilula kakhulu, ezi zixhobo zilandelayo zinceda kakhulu:
- Ukufakelwa kwamabhoksi okufudumalayo emoyeni (ngokuthe ngqo kwii-chips eziya kususwa)
- Chip-Quik
- Plat Hot
- Stereomicroscope
UkuPhakamisa ukuSungula
Ukuba iqela eliza kugqitywa kwiindawo ezifanayo apho iqela lisususwe ludinga ukulungelelanisa ukulungelelanisa ukusebenza okokuqala. Ngokuqhelekileyo inani elincinci le-solder lishiywe kwi-PCB ipads ezithintekayo kwii-pads zigcina ii-IC ziphakanyisiwe kwaye zinokuthintela zonke izikhonkwane zisetyenziswe ngokufanelekileyo. Kwakhona ukuba i-IC ine-pad ephantsi kwinqanaba elingaphezulu kwe-solder yabo inokuphakamisa i-IC okanye idale nzima ukulungisa izibhanti ze-solder ukuba ikhutshwe xa iCI icinezelwa phezulu. Iipasiti ziyakucocwa kwaye zifakwe ngokukhawuleza ngokudlula i-solder ezamahala soldering yinyithi phezu kwazo kunye nokususa i-solder engaphezulu.
Umvuzo
Kukho iindlela ezimbalwa zokususa ngokukhawuleza i-IC usebenzisa isiteshini sokuvuselela umoya oshisayo. Eyona nto isisiseko, kwaye enye yeyona nto elula ukuyisebenzisa, izisetyenziswa kukusebenzisa umoya oshushu kwiqumrhu usebenzisa ukunyakaza kwesetyhula ukuze i-solder kuzo zonke iinqununu zidibanise ngexesha elifanayo. Emva kokuba i-solder iyancibilikiweyo icandelo linokutshatyalaliswa ngeesibini.
Olunye ubuchule, olubaluleke kakhulu kwii-ICs ezinkulu kukusebenzisa i-Chip-Quik, i-solder ephantsi kakhulu yokushisa eyancibilika kwiqondo lokushisa elingaphantsi kune-solder standard. Xa iyancibilika nge-solder standard ixuba kwaye i-solder ihlala yimizi ngemizuzu emininzi inika ixesha elininzi lokususa i-IC.
Enye inqubo yokususa i-IC iqala ngokucima naluphi na izikhonkwane isigaba esicima kuso. Ukucima zonke izikhonkwane kuvumela i-IC ukuba isuswe kwaye mhlawumbi umoya oshisayo okanye isinyithi esinyukayo iyakwazi ukususa iinqaba zezikhonkwane.
Iingozi Ze-Solder Rework
Ukusebenzisa isiteshini sokuvuselela i-airder sherder ukususa izixhobo akuphelelanga ngokupheleleyo. Izinto eziqhelekileyo ezihamba kakubi zi:
- Ukuphazamisa izixhobo ezikufuphi - Azikho zonke izixhobo ezinokumelana nokushisa okufunekayo ukuze kususwe i-IC ngaphaya kwexesha apho lingathatha ukuncibilikisa i-solder kwi-IC. Ukusebenzisa izikhuselo zentsholongwane ezinjengefayili ye-aluminium kunokunceda ukukhusela umonakalo osondeleyo kwiindawo.
- Ukuphazamisa ibhodi ye-PCB - Xa umbhobho womoya oshushu ogcinwe ixesha elide ukutshisa iipini ezinkulu okanye ukupakisha i-PCB inokufudumala kakhulu kwaye iqalise ukususa. Indlela efanelekileyo yokukhusela oku kukutshisa izakhi ngokukhawuleza ukwenzela ukuba ibhodi elijikeleze kuyo ikwazi ukulungelelanisa ukutshintsha kweqondo lokushisa (okanye ukutshisa indawo enkulu ebhodini kunye nokunyakaza kwesetyhula). Ukutshisa i-PCB ngokukhawuleza kufana nokwehla i-ice cube kwiglasi elifudumele lamanzi-thintela uxinzelelo olushushu olushushu xa kunokwenzeka.